For: SW322522/453232/SPE32/43/CI0603/0805/1008/1210

 

 

High temperature storage test

 

 

 

Reference documents:

MIL-STD-202G Method 108A

 

 

 

 

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

 

Temperature:85¡¾2¡É

Time:96¡¾2hours

Tested not less than 1 hour, nor more than 2hours at room temperature.

 

 

 

Low temperature storage test

 

 

Reference documents:

IEC 68-2-1A 6.1 6.2

 

 

 

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

 

 

 

Temperature:85¡¾2¡É

Time:96¡¾2hours

Tested not less than 1 hour,nor more than 2hours at room temperature.

 

 

 

 

Humidity test

 

 

 

 

Reference documents:

MIL-STD-202G Method 103B

 

 

 

 

 

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

 

 

 

 

 

 

 

 

1.Dry oven at temperature of 40¡¾5¡É for 24 hours.

2.Measurements At the end of this period.

3.Exposure:Temperature: 40¡¾2¡É,Humidity:93¡¾3%RH

Time: 96¡¾2hours

4.Test while the specimens are still in the chamber

5.Tested not less than 1 hour,nor more than 2hours at room temperature.

 

 

Thermal shock test

 

 

Reference documents:

MIL-STD-202G Method 107G

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

For T:weight¡Â28g       :15Min

28g¡Âweight¡Â136g      :30Min

 

First-40¡É for T time, last125¡É T time as 1 cycle.

Go through 20 cycles.

For: SW322522/453232/SPE32/43/CI0603/0805/1008/1210

 

Solderability test

 

Reference documents:

MIL-STD-202G Method 208H

IPC-J-STD-002B

Terminals area must have 95%min. solder coverage

 

 

 

 

 

1.Dip pads in flux then in solder pot at 245¡¾5¡É for 5 seconds.

2.Solder: Sn(63)/Pb(37)

3.Flux: rosin flux

 

Heat endurance of Reflow

Soldering

 

Reference documents:

IPC J-STD-020B

 

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

 

1.Refer to next page reflow curve Go through 3 times

2.The peak temperature: 245¡¾5¡É

 

 

 

 

 

Vibration test

 

Reference documents:

MIL-STD-202G Method 201A

 

 

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

 

 

Apply frequency 10-55Hz. 0.75mm amplitude in each of perpendicular direction for 2 hours.(total 6 hours)

Drop test

 

Reference documents:

MIL-STD-202G Method 203C

 

 

1.No case deformation or change in appearance

2.¡âL/L¡Â10%

3.¡âQ/Q¡Â30%

4.¡âDCR/DCR¡Â30%

Packaged & Drop down from 1m with 981m/s2 (100G) attitude in 1 angle 1 ridges & 2 surfaces orientations.

 

 

 

 

Terminal strength push test

 

 

 

Reference documents:

JIS C 5321 :1997

 

 

 

 

Pulling test:

Define: A: sectional area of terminal

A¡Â8mm©÷         force¡Ã5N   time:30sec

8mm©÷

20mm©÷

 

Bending test:

Solding the products on PCB ,after the pulling test and bending test ,terminal should not pull off

Bend the testing PCB at middle point, the deflection shall be 2mm

Resistance to solvent test

Reference documents:

 

IEC 68-2-45:1993

No case deformation or change in appearance, or obliteration of marking

 

 

To dip parts into IPA solvent for 5¡¾0.5Min, then drying them at room temp for 5Min, at last, to brushing marking 10times.